Publications

Published research

Journal articles

20 journal articles with original publication titles, authors, and citation details.

  1. 20
    Stacked quantum dot organic light-emitting diodes in an industrial-grade inkjet printing process

    Byoung-Hwa Kwon, Jin-Wook Shin, Chul Woong Joo, Chan-Mo Kang, Hyunsu Cho, Sukyung Choi, Yoonsung Yoo, Hyungwoo Suh, Dong-Kyun Shin, Jaeryul Yu, Yeon Soo Lee, Seongju Kim, Sungjune Jung, Chun Sakong, Chun-Won Byun, Nam Sung Cho

    Chemical Engineering Journal, 177307 (2026).
  2. 19
    Statistically Resolving Thickness‐Dependent Electrical Characteristics in Multilayer‐MoS2 Transistors

    Sanghyun Lee, Sumin Hong, Minho Park, Seongju Kim, Sanghoon Baek, Seonguk Yang, Chang‐Soo Lee, Sang‐Hoon Bae, Joonki Suh, Yongwoo Lee, Haksoon Jung, Jimin Kwon

    Advanced Functional Materials, 36 (45), e32204 (2026).
  3. 18
    Functional Nano-to-Microstructures by Jet Printing and Direct Ink Writing

    Junchen Luo, Ju An Park, Sanghoon Baek, Seongju Kim, Unyong Jeong*, Sungjune Jung*

    Chemical Reviews, 126, 3761 - 3828 (2026).
  4. 17
    Ultrasound-Mediated Polymer Processing to Control Viscoelasticity for Inkjet-Printed Polymer LEDs

    Dongryul Lee, Seongju Kim, Yunji Lee, Seok Hwan Jang, Jeonghwan You, Jeongheon Park, Changsoon Cho*, Jun Young Kim*, Sungjune Jung*

    ACS Applied Materials & Interfaces, 18, 14046–14055 (2026).
  5. 16
    Reinforcement Learning-Based Dynamic Optimization of Driving Waveforms for Inkjet Printing of Viscoelastic Fluids

    Seongju Kim, Minsu Cho, Sungjune Jung*

    Langmuir, 41, 17 (2025).
  6. 15
    Strategic Direct Printing for High-Performance and Uniform Organic Thin-Film Transistor Arrays

    Gyungin Ryu, Youngmin Jo, Seongju Kim, Christian B. Nielsen, Woojo Kim*, Sungjune Jung*

    Advanced Materials Technologies, 10, 2500234 (2025).
  7. 14
    Evaluating inkjet printability of viscoelastic ink through Deborah number analysis

    Seongju Kim, Jules M. Richardot, Sungjune Jung*

    Physics of Fluids, 37, 023135 (2025).
  8. 13
    3D active-matrix multimodal sensor arrays for independent detection of pressure and temperature

    Youngmin Jo, Youngoh Lee, Jimin Kwon, Seongju Kim, Gyungin Ryu, Soyoung Yun, Sanghoon Baek*, Hyunhyub Ko*, Sungjune Jung*

    Science Advances, 11, 3 (2025).
  9. 12
    Evaporative Morphology Tuning of Conducting Polymer Films Under Controlled Vacuum Conditions

    Seongju Kim, Byung Mook Weon, Dong Jin Kang, Sungjune Jung*

    Advanced Science, 12, 2408790 (2024).
  10. 11
    Predicting inkjet jetting behavior for viscoelastic inks using machine learning

    Seongju Kim, Raphaël Wenger, Olivier Bürgy, Gioele Balestra, Unyong Jeong, Sungjune Jung*

    Flexible and Printed Electronics, 8, 035007 (2023).
  11. 10
    Effect of Aronia Extract on Collagen Synthesis in Human Skin Cell and Dermal Equivalent

    Hwa-Rim Lee, Hye Guk Ryu, Yunji Lee, Ju An Park, Seongju Kim, Chang Eon Lee, Sungjune Jung*, Kyung-Ha Lee*

    Oxidative Medicine and Cellular Longevity, 2022, 4392256 (2022).
  12. 9
    The design of an inkjet drive waveform using machine learning

    Seongju Kim, Minsu Cho, Sungjune Jung*

    Scientific Reports, 12, 4841 (2022).
  13. 8
    Spatiotemporal Measurement of Arterial Pulse Waves Enabled by Wearable Active-Matrix Pressure Sensor Arrays

    Sanghoon Baek, Youngoh Lee, Jinhyeok Baek, Jimin Kwon, Seongju Kim, Seungjae Lee, Karl-Philipp Strunk, Sebastian Stehlin, Christian Melzer, Sung-Min Park, Hyunhyub Ko*, Sungjune Jung*

    ACS Nano, 16, 368–377 (2022).
  14. 7
    Printed Organic Light-Emitting Diodes on Fabric with Roll-to-Roll Sputtered ITO Anode and Poly(vinyl alcohol) Planarization Layer

    Sunyoung Sohn*, Seongju Kim, Jae Won Shim, Sang Kooun Jung, Sungjune Jung*

    ACS Applied Materials & Interfaces, 13, 28521–28528 (2021).
  15. 6
    3D microextrusion-inkjet hybrid printing of structured human skin equivalents

    Hwa-Rim Lee, Ju An Park, Seongju Kim, Youngmin Jo, Dayoon Kang, Sungjune Jung*

    Bioprinting, 22, e00143 (2021).
  16. 5
    All-Inkjet-Printed 3D Alveolar Barrier Model with Physiologically Relevant Microarchitecture

    Dayoon Kang, Ju An Park, Woojo Kim, Seongju Kim, Hwa-Rim Lee, Woo-Jong Kim, Joo-Yeon Yoo, Sungjune Jung*

    Advanced Science, 8, 2004990 (2021).
  17. 4
    A new approach to the restoration of seaweed beds using Sargassum fulvellum

    Sang Mok Jung, Ji Hyun Lee, Seung Hee Han, Won Bin Jeon, Ga Yeon Kim, Sinyang Kim, Seongju Kim, Hwa-Rim Lee, Dong Soo Hwang, Sungjune Jung, Jongdae Lee, Hyun Woung Shin*

    Journal of Applied Phycology, 32, 2575–2581 (2020).
  18. 3
    Mechanical Stimuli Enhance the Growth of Ulva fasciata (Chlorophyta) Spores

    Sang Mok Jung, Sinyang Kim, Jihyun Park, Hwa-Rim Lee, Seongju Kim, Hee-Jung Jung, Sungjune Jung, Hyun Woung Shin*, Dong Soo Hwang*

    ACS Sustainable Chemistry & Engineering, 8, 10073–10078 (2020).
  19. 2
    Immobilization of planktonic algal spores by inkjet printing

    Hwa-Rim Lee, Sang Mok Jung, Sejeong Yoon, Woong Hee Yoon, Tae Hee Park, Seongju Kim, Hyun Woung Shin*, Dong Soo Hwang*, Sungjune Jung*

    Scientific Reports, 9, 12357 (2019).
  20. 1
    Parylene-Based Double-Layer Gate Dielectrics for Organic Field-Effect Transistors

    Hyunjin Park, Hyungju Ahn, Jimin Kwon, Seongju Kim, Sungjune Jung*

    ACS Applied Materials & Interfaces, 10, 37767–37772 (2018).

International conferences

6 conference presentations with original titles, authors, and venue details.

  1. 6
    Vertical-Die (V-die) 3.5D Integration for Cool Ultrahigh-Bandwidth Memory Systems

    Heesoo Yang, Hyeongjun Kim, Yurim Choi, Seungmin Lee, Dongyun Kam, Haksoon Jung, Yongwoo Lee, Seongju Kim, Jimin Kwon

    2026 IEEE/JSAP Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 1–3 (2026).
  2. 5
    Microchannel-Embedded 3D-Printed Ceramic Substrates for Liquid-Cooled Power Module Packaging

    Haksoon Jung, Seongju Kim, Nahyeon Kim, Seungjun Chung, Jimin Kwon

    2026 IEEE 76th Electronic Components and Technology Conference (ECTC), 1462–1466 (2026).
  3. 4
    Active BSCDN Benchmark Framework with Backsdie-Compatible CNFET Logic Technology

    Yehyun Shin, Ikkyum Kim, Minho Park, Junghyun Yoon, Seunghun Baek, Seongmin Eum, Heesoo Yang, Yurim Choi, Jaeyong Jeong, Sanhyun Kim, Haksoon Jung, Seongju Kim*, Heechun Park, and Jimin Kwon

    71st International Electron Devices Meeting (IEDM), 2025.
  4. 3
    Monolithic 3D Integration of Ⅲ-Ⅴ HEMTs on Glass Using Ultra-Thin Dielectric Bonding Layer: A High-Frequency and Low-Loss Active Glass Platform for Sub-THz Applications

    Jaeyong Jeong, Yurim Choi, Seongju Kim, Hyeongjun Kim, Jimin Kwon, and Sanhyeon Kim

    71st International Electron Devices Meeting (IEDM), 2025.
  5. 2
    3D Printed Fanout Interposer Substrates with Curved Through-Holes for Rapid Prototyping of Advanced Packaging

    Haksoon Jung, Nahyeon Kim, Yurim Choi, Seongju Kim, Hyunjin Park, Yunsik Park, Seungjun Chung, Jiheong Kang, Jimin Kwon

    Electronics Components and Technology Conference (ECTC), 2025.
  6. 1
    Quasi-Coaxial Through-Hole Integrated Additively Manufactured Antenna-in-Package Lid Substrates

    Nahyeun Kim, Haksoon Jung, Yurim Choi, Hyeongjun Kim, Seongju Kim, Yongwoo Lee, Yunsik Park, Seungyeon Koh, Hyeok Kim, Jimin Kwon

    Electronics Components and Technology Conference (ECTC), 2025.